MA-DGIC Product Information

Molecular Information

Molecular Formula: C₁₂H₁₅N₃O₅

Molecular Weight: 281.26

CAS Number: 69731-45-9

Function and Uses

Features a skeleton characterized by "high strength and heat resistance", "transparency and light resistance", and "multiple variations".

• Suitable as a crosslinking agent for epoxy resins. Yields cured products with high heat resistance and excellent transparency.

• Used as a crosslinking agent for PPE and BMI resins to achieve low dielectric constant and loss factor.

• DA-MGIC and MA-DGIC exhibit good compatibility with resins. Typical applications compatible with epoxy resins include low-temperature curing adhesives, LED peripheral materials, photoresists, flux, and may also assist in optimizing the electrical insulation properties of epoxy resins.

1. As a heat resistance promoter for polyester resins: Incorporating DA-MGIC into polyester resins, followed by heating and UV curing, enhances heat resistance and flame retardancy.

2. As a crosslinking agent: Can be used as a crosslinking agent for polyolefins and synthetic rubbers synthesized with peroxides and photoinitiators.

Table 1: MA-DGIC General Physical Properties

Packaging and Storage

Available in 25 kg plastic drums, 190 kg standard steel drums, and IBC totes.

Store indoors away from light in a well-ventilated, cool, and dry place.

Ensure drum lids are tightly sealed to effectively isolate from air, as moisture in the air can react with the product, leading to hydrolysis, polymerization, and deterioration.